Chipset

Intel GS45 Express chipset
Integrated TPM

Memory

DDR3 memory upto 8Gbytes

Video

Dual channel LVDS
VGA, TV

Ethernet

1 10/100/1G Ethernet

Disk interfaces

4 SATA ports

USB

8 Ports

Environment

0°C to 70°C Operational
-20°C to 70°C Operational option
-40°C to 100°C Storage
RH 0 to 95% non condensing
Extended temperature range option

Module size

Type 3 Com Express Basic Module size, 125x95mm

COM Express PICMG Standard

By offering the Type 3 Com Express size, 125 x 95mm, compact designs
can be achieved. The COM (Computer On Module) Express standard has
been generated by the PICMG group to benefit from the advances offered
by the PCI Express interface and to offer the OEM a selection of suppliers
that can be based on support and supply
          

COM Express Carrier board design

Microbus are able to undertake custom design of carrier boards and offer a
design checking service for OEMs own design.
            

CUSTOM

Microbus CUSTOM utility supports best effort boot and automatic recovery.
               

Temperature Range

Extended temperature up to option available
             

By offering access to the low power Core 2 Duo processors, the MAT1250 is
ideal for sealed and compact systems.

Organised thermal management can be achieved by use of the purpose designed
heat spreader plate.

Ruggedness is achieved through the thicker PCB. Extended temperature support
is also available. These are features that support the MAT1250 being using in
harsh environments such as Military, Medical, Rigged Mobile and Telecoms.

By using established core technology for a wide range of interfaces, including
serial, Ethernets, video capture and other interfaces Microbus can offer
custom carrier board design for demanding applications.